介绍了厚膜技术研讨会

Seminar Agenda & Session Overviews

2019年6月11日至12日

DAY 1 TUESDAY, JUNE 11, 2019
上午7:45Coffee
8:00 AMWelcome & Introduction to PVAM
Manufacturing and Quality Assurance of DuPont Thick Film Materials
The thick film composition is broken down into individual components such as metal powder, glass frit, vehicles and solvents. We show how each component is manufactured, types of industrial equipment used, and how they are QC tested and controlled for quality and consistency.
Conductor Technology & Solderable Conductors
Conductors are used for conductive lines, lead pads, resistor terminations, electrodes for passive components, soldering & brazing. Metallurgies, binder types, and rheology and their impact on conductor functional performance and properties are discussed. There are many conductor compositions available for a variety of different applications.

Wire Bonding
通常在需要电线粘合并使用高可靠性应用时使用黄金导体。讨论了带金和铝线的电线粘结过程细节。

Dielectric Technology
There are four main types of thick film dielectrics; multilayer and crossover, capacitor, and encapsulant dielectrics. Important characteristics and performance properties are critical to insure their proper function. These are examined, as well as the testing methods used to validate them.
辐透ovoltaic Technology
This is an introduction into PV thick film technology, and includes a discussion about solar applications, processing wafers, performance requirements, and various compositions.
Polymer Thick Film/Printed Electronics
这些材料也称为“导电油墨”或“ PTF”,仅在固化或干燥以去除溶剂后才显示出电气性能。这些材料的应用包括膜触摸开关,RFID标签,生物传感器,电池,燃料电池,可穿戴设备和内装应用程序等。
Etchable Thick Film & Specialty Technologies
Technologies are discussed that enable fine feature formation beyond conventional screen printing technology. Fodel®, etching, Diffusion Patterning™ technologies, Laser-structurable materials are covered. Specialty materials for Aluminum, stainless steel, aluminum nitride, and glass are discussed. Lead free products are cited.

LTCC简介
The technology and process of Low Temperature Cofired Ceramics is introduced. Green Tape™ 951, and 9K7 systems are discussed.

实验室旅行1
Day 1 lab facility tours include the LTCC (Low Temperature Cofired Ceramic) prototyping area, Large format printing and Photovoltaic lab areas.
5:30pmCocktails and Dinner
DAY 2 WEDNESDAY, JUNE 12, 2019
上午7:45Coffee
Resistor Technology
Thick film resistor compositions consist of an electrically conductive phase and an insulating phase. Resistor performance (R, TCR, length effects, power handling, etc) can be influenced by the resistor composition selection. Various processing details are discussed to help insure intended performance.
Furnace and Firing Technology
Firing is a complex process. Various furnace designs are examined. Profiles and airflow details are examined to insure consistent performance or improve yields.

激光修剪
激光修剪用于调整单个电阻值。除激光修剪器制造商的指导外,要遵循的一般规则将有助于确保可以满足性能要求。

Screen Printing Technology, Viscosity & Rheology
There are many details involved with screen printing. “Best practices” are discussed in detail to select the proper screen, mesh, emulsion, squeegee, print speed, printer setup, etc., ultimately to help improve control of thick film deposition. This section provides a thorough understanding of the printing process to enable one to troubleshoot and solve printing problems.

底物相互作用
Various thick film compositions are designed and QA tested to be compatible with a specific substrate, whether it is 96% alumina, BeO, AlN, glass, Mylar®, paper, etc. Important characteristics are explained so that the proper compatible materials can be selected.
多层互连结构
One way to increase circuit density is with multilayer processing of dielectric layers and conductor layers. This process is described in detail and a complete material set is examined.

Very low temp materials & Inkjet
In applications that use sensitive substrates specially modified paste are required to allow ultra-low curing temperatures as low as 60°C to be used.

Lab Tours
Lab facilities are opened to show typical steps involved with thick film manufacturing & processing. Screen printing, soldering, firing, laser trimming, wire bonding, and screen preparation areas are included.

3:30pm - Wrap-up and Adjourn

杜邦代表将与您联系以确认您的出勤率并提供有关住宿的详细信息。