Advanced Flip-Chip packages demand higher functionality in increasingly fine pitch substrates, resulting in the need to reliably create fine metal features. DuPont™ Microfill™ LVF IV Acid Copper plating process has been designed to meet these needs, using insoluble anodes and direct current (DC) plating in electroplating systems designed for substrate manufacturing.

• 设计用于图案板能力，具有优异的激光微孔填充和倒装芯片基板的图案板均匀性。
• 具有不溶性阳极的DC工艺，以最小化空闲时间效应。
• 明亮，高度平整的，韧性沉积物
• Easily analyzed and controlled by conventional CVS techniques.
• 具有不同产品要求的高度可调过程。